1/4 rev. b structure silicon monolit hic integrated circuits product series 2-in-1 motor driver for vtr type bd6903efv function ? vtr cylinder motor driver (sensorless 3-phas e full-wave soft switching drive system) ? vtr loading motor driver absolute maximum ratings (ta=25 ) parameter symbol limit unit supply voltage vcc 7 v vm 15 v vg 20 v power dissipation pd 1000 1 mw operating temperature range topr -20 +75 storage temperature range tstg -55 +150 maximum output current (cylinder block) iomax1 800 2 ma maximum output current (loading block) iomax2 1000 2 ma junction temperature tjmax +150 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 8.0mw/ for operating above ta=25 . 2 do not, however exceed pd, aso and tjmax=150 . recommended operating conditions (ta= -25 +75 ) parameter symbol min typ max unit supply voltage vcc 4.5 5 5.5 v vm 9 12 13.5 v vg vm+3 17 19 v uin, vin, win in-phase input voltage range vbemfd 0 - vm v pg amp in-phase input voltage range vpd 1.5 - 3.0 v this product described in this specification isn?t judged whether it applies to cocom regulations. please confirm in case of export. this product isn?t designed for prot ection against radioactive rays.
2/4 rev. b electrical characteristics (unl ess otherwise specified, ta=25 , vcc=5v, vm =12v, vg=17v) parameter symbol limit unit conditions min typ max overall vcc total supply current icc - 9.2 14.2 ma vm total supply current 1 im1 - 1.4 2.8 ma lin=h or l vm total supply current 2 im2 - 1.4 2.8 ma lin=m output high-side output saturation voltage voh - 0.4 0.8 v io=-400ma low-side output saturation voltage vol - 0.3 0.6 v io=400ma torque reference ec input bias current iec - 0.5 2 a torque reference start voltage vecr 2.35 2.5 2.65 v torque reference i/o gain gio 0.72 0.99 1.28 a/v ec=2.6v-2.7v gain output (hlm) rrnf = 0.5 soft switch ct1, ct2 charge current ictd -50 -35 -25 a ct1, ct2 discharge current icti 27 40 56 a high ct1, ct2 clamp voltage vcth 4.4 4.7 - v low ct1, ct2 clamp voltage vctl 0.8 1.0 1.3 v startup control logic cst charge current icstd -20 -14 -6 a cst discharge current icsti 2 6 10 a high cst clamp voltage vcsth 2.4 2.8 3.3 v low cst clamp voltage vcstl 0.8 1.0 1.3 v pg amp input bias current ipg- - 0.1 0.25 a pg-=gnd dc bias voltage vpg 2.25 2.5 2.75 v pg-=pgout voltage gain 1 av1 17.5 18.8 - db f=1khz high output voltage vohp 3.4 3.75 v ioh=-1ma low output voltage volp - 1.2 1.6 v iol=1ma hys amp hysteresis width vhysp -75 -100 -125 mv pfgpin high output voltage vpfgp 4.5 - - v io=-10 a middle output voltage vpfgm 2.25 - 2.75 v io= 10 a low output voltage vpfgl - - 0.5 v io=10 a loading high-level lin input vlinh 3.5 - - v loading: forward rotation middle-level lin input vlinm 2.35 - 2.65 v loading: brake low-level lin input vlinl - - 1.5 v loading: reverse rotation lin bias voltage vlinb 2.35 2.5 2.65 v output saturation voltage vce - 0.3 0.6 v io=200ma, total of output transistor high-side and low-side voltage source currents are treated as negative while sinking currents are treated as positive.
3/4 rev. b package outline block diagram pin no. / pin name pin no. pin name 1 gnd 2 lin 3 ec 4 ct1 5 ct2 6 cst 7 cnf 8 pgout 9 pg- 10 vcc 11 w 12 v 13 rnf 14 u 15 vg 16 vm 17 out1 18 out2 19 lgnd 20 pfg drive signal vm out2 out1 vcc lgnd pgfg synthesis startup control logic soft switch waveform tsd pre-drive control logic v u w rnf vg lin gnd pfg pgout pg- cst ct1 ct2 ec cnf vcc back emf detection comparator buffer output err amp cs amp pg amp hysteresis comparator selector pre-drive bd6903efv lot no. htssop-b20 (unit:mm) product no. max 6.85 (include. burr)
4/4 rev. b operation notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings such as the applied voltage or operating temperature range (topr) may result in ic damage. assumptions should not be made regardi ng the state of the ic (short mode or open mode) when such damage is suffered. the implementation of a physical safety m easure such as a fuse should be considered when use of the ic in a special mode where the absolute maxi mum ratings may be exceeded is anticipated. (2) power supply lines regenerated current may flow as a result of the motor's back el ectromotive force. insert capa citors between the power supply and ground pins to serve as a route for regenerated current. de termine the capacitance in full consideration of all the characteristics of the electrolytic capaci tor, because the electrolytic capacitor may loose some capacitance at low temperature s. if the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circ uitry may exceed the absolute maximum ratings. it is recommended to implement a physical safe ty measure such as the insertion of a voltage clamp diode between the power supply and gnd pins. (3) ground potential ensure a minimum gnd pin potenti al in all operating conditions. (4) setting of heat use a thermal design that allows for a sufficient margin in li ght of the power dissipation (pd) in actual operating conditions. this ic exposes its frame of the backside of package. note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. try to occupy as wide as possible with heat dissipation pattern not only on t he board surface but also the backside. (5) actions in strong magnetic field use caution when using the ic in the presence of a strong magnetic field as doi ng so may cause the ic to malfunction. (6) aso when using the ic, set the output transistor for the motor so that it does not exceed absolute maximum ratings or aso. (7) thermal shutdown circuit this ic incorporates a tsd (thermal s hutdown) circuit (tsd circuit). if the tem perature of the chip reaches the following temperature, the motor coil output will be opened.the thermal shutdo wn circuit (tsd circuit) is designed only to shut the ic of f to prevent runaway thermal operation. it is not designed to protec t the ic or guarantee its operation. do not continue to use t he ic after operating this circuit or use the ic in an envi ronment where the operation of this circuit is assumed. tsd on temperature [c] (typ.) hysteresis temperature [c] (typ.) 170 20 (8) ground wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal gr ound voltage. be careful not to change the gnd wiring pattern of any external components, either.
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